Texas Instruments Newest Wireless Infrastructure Processor Propels Emerging Market Applications Within GSM, TD-SCDMA and WiMAX

Texas Instruments Newest Wireless Infrastructure Processor Propels Emerging Market Applications Within GSM, TD-SCDMA and WiMAX

December 19, 2006

3GHz Multi-Core Baseband Product Addresses Future Needs of
OFDMA/LTE Air 
Interfaces


    HONG KONG, Dec. 4 /Xinhua-PRNewswire/ -- Texas
Instruments Incorporated 
(TI) (NYSE: TXN) today announced its newest 3GHz-performing
wireless 
infrastructure baseband product that boosts applications
for GSM-based base 
stations while addressing new markets and requirements for
WiMAX and TD-
SCDMA. With three cores running at 1GHz each, the
TMS320TCI6487  processor 
enables base station manufacturers to extend their existing
designs while 
entering into new markets, requiring small form factor
applications with an 
exceptional scaleable, flexible solution.  For more
information, please visit 
http://www.ti.com/tci6487 .

    (Logo: 
http://www.xprn.com.cn:9080/xprn/sa/20061107170439-20.jpg )

    "Wireless infrastructure requirements are
constantly changing and 
evolving, with regional and form factor opportunities
growing quickly," said 
Flint Pulskamp, wireless semiconductor analyst at IDC.
"Offering a single, 
flexible solution to manufacturers and service providers to
solve their needs 
for quick regional deployments for GSM, TD-SCDMA and WiMAX
further 
strengthens TI's strong position in this market
space."

    Single Solution for Multiple Standards 

    Currently, there are more than two billion GSM
subscribers in 210 
countries around the world. With TI's TCI6487,
manufacturers will be able to 
deliver a high-performance, low-cost infrastructure
solution for this market 
that supports up to 10 EDGE-enabled carriers with a single
chip. In addition 
to supporting more users, the multi-core DSP provides
enhanced capabilities 
for GSM, including interference cancellation and better
reception for high 
data-rate applications. This flexible, software upgradeable
solution reduces 
overall infrastructure costs, enabling service providers to
deploy baseband 
technology in new emerging markets such as those in India,
Russia, Africa and 
South America. 

    Texas Instruments' TCI6487 is also optimized for
infrastructure designs 
of TD-SCDMA, China's unique air interface. With
pre-commercial trials 
currently underway for TD-SCDMA, it is anticipated that the
standard will be 
widely deployed in advance of the 2008 Olympic Games in
Beijing, requiring a 
solution that can immediately meet the needs of this huge
cellular market. 
The 3GHz "baseband on a chip" can support three
carriers and 69 users per 
device. 

    Building on TI's current WiMAX leadership, the TCI6487
is an excellent 
solution that meets the unique needs of today's emerging
OFDMA requirements 
and tomorrow's LTE demands. The single-chip DSP solution,
works in 
conjunction with TI's optimized software library, complete
analog front end 
and key products from third parties. Now, TI's WiMAX
customers can quickly 
get to market with advanced products for current
requirements and the ability 
to shrink as future smaller form factor requirements
demand. A complete 10-
MHz, 2-antenna, 3-sector solution can easily be
implemented, improving 
overall cost and power per channel.

    "Flexibility is key in infrastructure design, as
the market constantly 
evolves and infrastructure requirements change to support
newer features and 
services," said Jerold Givens, TI Communications
Infrastructure DSP 
director.  "While we have insight into what the next
paradigm shift is 
likely to be in the wireless space in the coming years, it
is important for 
us to offer our customers a solution that is flexible
enough to meet a 
variety of today's industry requirements and powerful
enough to take them to 
tomorrow's next phase in wireless infrastructure
design."

    Higher-Performance DSP Baseband Solution

    TI's TCI6487 offers three-times the performance of
previous 
infrastructure solutions, providing greater channel
enhancement and more 
flexibility while reducing design complexity for OEMs.
Manufactured in 65nm 
process node, this new DSP is the highest performing
processor in TI's 
TMS320C64x+ DSP family. As a result, carriers will be able
to deploy advanced 
networks quickly while future proofing their investments.
The ability to 
upgrade performance with software enhancements also enables
service providers 
to support emerging standards such as LTE, 3GPP and 3GPP+,
while easily 
adding new features and services to their networks. This,
in turn, will 
provide subscribers access to the latest and greatest
services and 
capabilities that the wireless world can deliver.

    TI offers the industry's broadest wireless
infrastructure product 
portfolio, spanning the complete signal chain. Supporting
analog products 
include digital up/down converters, high speed data
converters, RF products, 
timing, backplane interface and standard logic components.
Highlighting the 
company's leadership in power management, TI has developed
a non-isolated 
DC/DC power module with extremely fast response and high
performance. It is 
the first power management device to meet core voltage
tolerance requirements 
of the TCI6487. 

    Availability

    The TCI6487 is currently sampling with targeted
customers. It will be on 
display at the ITU Telecom show, Dec. 4-8 in Hong Kong in
Hall 2, Booth 2010. 
For more information, please visit
http://www.ti.com/tci6487 .

    About Texas Instruments

    Texas Instruments Incorporated provides innovative DSP
and analog 
technologies to meet our customers' real world signal
processing 
requirements.  In addition to Semiconductor, the company
includes the 
Educational & Productivity Solutions business. TI is
headquartered in Dallas, 
Texas, and has manufacturing, design or sales operations in
more than 25 
countries.

    Texas Instruments is traded on the New York Stock
Exchange under the 
symbol TXN. More information is located on the World Wide
Web at 
http://www.ti.com .

    Safe Harbor Statement

    Statements contained in this news release regarding TI
product 
availability and other statements of management's beliefs,
goals and 
expectations may be considered forward-looking statements
as that term is 
defined in the Private Securities Litigation Reform Act of
1995, and are 
subject to risks and uncertainties that could cause actual
results to differ 
materially from those expressed or implied by these
statements. The following 
factors and the factors discussed in TI's most recent Form
10-K could cause 
actual results to differ materially from the statements
contained in this 
news release: actual market demand for amplifier products
and TI products 
specifically, and actual test results relating to TI
products. TI disclaims 
any intention or obligation to update any forward-looking
statements as a 
result of developments occurring after the date of this
news release.

    Trademarks

    All trademarks and registered trademarks are property
of their respective 
owners.


    For more information, please contact:

     Marcia Barnett
     Texas Instruments	
     Tel:   [phone]
     Email: [e-mail]

     Erin Arnold
     GolinHarris
     Tel:   [phone]
     email: [e-mail]



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