Industry's First Integrated 802.11n WLAN, Bluetooth(R) 2.1 and FM Single Chip from Texas Instruments Brings Affordable Connectivity to Mass Market Handsets

Industry's First Integrated 802.11n WLAN, Bluetooth(R) 2.1 and FM Single Chip from Texas Instruments Brings Affordable Connectivity to Mass Market Handsets

February 07, 2007

Leader in Mobile WLAN Introduces New 65nm Solutions Based
on TI DRP(TM) Technology


    DALLAS, Feb. 7 /Xinhua-PRNewswire/ -- Texas Instruments
Incorporated (TI) (NYSE: TXN) today announced two new
devices built on the company's leading DRP(TM) single-chip
technology designed to drive affordable WLAN, Bluetooth(R)
and FM technologies into mass market handsets. The first
product is WiLink(TM) 6.0, a single chip that is the latest
member of TI's mobile WLAN (mWLAN) family, and is the
industry's first device to integrate a complete offering of
mobile WLAN, Bluetooth and FM, with support for IEEE draft
802.11n for better coverage and reception.  The second
product is the BlueLink(TM) 7.0 solution, the latest
version of TI's BlueLink(TM) Bluetooth single-chip family
that integrates Bluetooth and FM. The FM functionality in
both devices delivers FM transmit and receive capabilities,
turning the handset into a personal area broadcast device. 

    (Logo:
http://www.xprn.com.cn/xprn/sa/20061107170439-20.jpg )

    The new chips are tightly integrated monolithic
solutions that enable the functionality demanded by today's
consumers, allowing them to send and receive more data on
their mobile phones with an enhanced voice and audio
experience. Both devices are manufactured in leading-edge
65-nanometer (nm) technology, delivering a low-cost,
low-power single chip with a small footprint.

    Enabling Affordable WLAN, Bluetooth and FM for
Mainstream Handsets

    The new WiLink 6.0 device integrates mWLAN, Bluetooth
and FM on a single chip, allowing handset manufacturers to
quickly and seamlessly integrate these three functions into
feature-rich mainstream handsets, giving more consumers
access to features usually found only in high-end handsets.
By integrating the industry's first mobile 802.11n solution,
consumers can seamlessly and quickly share large files such
as movies and photos between their handsets and other
WLAN-enabled devices, like laptops, digital cameras and
gaming consoles. Operators and service providers deploying
dual-mode phone solutions expect 802.11n to drastically
improve voice call quality and reliability in VoWLAN
applications. The WiLink 6.0 device will help reduce
dropped calls, lowering support costs for these newer, more
complex dual-mode solutions.

    The new BlueLink 7.0 device integrates the industry's
best-performance Bluetooth technology with high-quality FM
stereo transmit and receive functions on a single chip.
With new FM transmit capability, consumers can enjoy MP3
files stored on their phone on any FM receiver, such as car
stereos or radios without wires. The new chip also provides
enhanced performance with support for Bluetooth
Specification 2.1 plus EDR (enhanced data rate). The WiLink
6.0 solution and BlueLink 7.0 device share the same
Bluetooth and FM core solution, allowing customers to
capitalize on their past and future software investments in
a versatile manner.  

    "The phone is now the consumer's center of gravity
- the one device they use to entertain, connect and access
information. With the WiLink 6.0 single chip, TI is
enabling true voice over IP and personal audio broadcasting
- allowing people to use their phone in ways they never have
before," said Marc Cetto, General Manager of TI's
Mobile Connectivity Solutions. "TI's deep expertise in
wireless and leading edge process technology makes us well
positioned to take Bluetooth and mobile WLAN to the next
level and make them affordable for more consumers around
the globe."

    Combined with single-chip modem solutions from TI,
handset manufacturers have a complete "antenna to
application" solution for mid-tier and low-end
handsets. TI's WiLink 6.0 platform can work with the
OMAP-Vox(TM) family of solutions, including the OMAPV1030
processor and OMAPV1035 "eCosto" single-chip EDGE
solution, to provide an optimized modem, applications
processor and mWLAN/Bluetooth/FM solution for mid-tier
handsets. Coupled with TI's "LoCosto" single chip
platform, BlueLink 7.0 is a cost-efficient solution to
increase Bluetooth penetration in handsets by addressing
the high-volume, low-cost emerging handset market.

    "Mobile devices with both WLAN and Bluetooth are
primarily found in the high-end of the global handset
market today. A more affordable, integrated mWLAN and
Bluetooth solution, such as TI's new WiLink 6.0 single
chip, should help push these key technologies toward the
mid- and low-tier segments, and into the hands of more
mass-market users," said Neil Mawston, Associate
Director of the Global Wireless Practice, Strategy
Analytics.

    TI leads the market in mobile WLAN shipments for
handset applications, according to Forward Concepts. Using
this expertise, the new WiLink 6.0 device is designed to
meet increasing consumer demand for PC-style
high-throughput connectivity on the go without compromising
battery life. The combination of mWLAN, Bluetooth and FM
functionality allows users to perform a variety of
simultaneous tasks, such as listening to the radio on a
Bluetooth headset while checking email via mWLAN. 

    Designed with TI's innovative DRP technology, the
BlueLink 7.0 device cuts power consumption by 20 percent
over previous generations in critical modes of operation.
It also provides superior "class 1.5"
functionality, which enables high transmit power without an
additional external power amplifier, delivering improved
sensitivity and RF performance. 

    TI also brings seamless cellular and WLAN connectivity
for emerging IMS applications by leveraging its VoWLAN
functionality provided by TI's OMAP-Vox and WiLink
solutions. IMS gives consumers on-the-go voice access over
WLAN or the cellular network using their mobile phones.

    Proven Coexistence Platform

    The new WiLink 6.0 and BlueLink 7.0 solutions include
TI's proven robust coexistence platform which addresses
system-wide interference issues, encompassing radio design
and hardware and software solutions. Coexistence expertise
is becoming increasingly important as more radios are being
added to the handset. TI leads the market in coexistence
solutions for Bluetooth and mWLAN, with more than 30
handsets using TI's coexistence platform.  

    Availability

    Handsets are expected to be on the market with TI's
WiLink 6.0 and BlueLink 7.0 in 2008. 

    Texas Instruments - Making Wireless

    TI is the leading manufacturer of wireless
semiconductors, delivering the heart of today's wireless
technology and building solutions for tomorrow.  TI
provides a breadth of silicon and software and 16 years of
wireless systems expertise that spans handsets and base
stations for all communications standards, wireless LAN,
GPS, Digital TV, Bluetooth(R) and Ultra Wideband.  TI
offers custom to turn-key solutions, including complete
chipsets and reference designs, OMAP(TM) application
processors, as well as core digital signal processor and
analog technologies built on advanced semiconductor
processes.  Please visit
http://www.ti.com/wirelesspressroom for additional
information.

    About Texas Instruments:

    Texas Instruments Incorporated provides innovative DSP
and analog technologies to meet our customers' real world
signal processing requirements.  In addition to
Semiconductor, the company includes the Education
Technology business.  TI is headquartered in Dallas, Texas,
and has manufacturing, design or sales operations in more
than 25 countries.

    Texas Instruments is traded on the New York Stock
Exchange under the symbol TXN.  More information is located
on the World Wide Web at http://www.ti.com .

    Trademarks

    WiLink, BlueLink, DRP, OMAP and OMAP-Vox are trademarks
of Texas Instruments.  Wi-Fi is a registered trademark of
the Wi-Fi Alliance.  Bluetooth word mark and logos are
owned by the Bluetooth SIG, Inc. and any use of such marks
by Texas Instruments is under license.  All other
trademarks and registered trademarks are property of their
respective owners.


    For more information, please contact:

    Media Contacts:

     Tracy W. Steiner
     Texas Instruments
     Tel:   [phone]
     Email: [e-mail] 

     Stephanie Stewart
     GolinHarris
     Tel:   [phone]
     Email: [e-mail] 


SOURCE  Texas Instruments