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2025'08.02.Sat
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2007'02.02.Fri
Texas Instruments Delivers Seamless Wi-Fi Connectivity at Home and On the Go
May 31, 2006

Latest Development Kit Provides WLAN for Battery-Operated Devices
    DALLAS, May 31 /Xinhua-PRNewswire/ -- Texas Instruments
Incorporated (TI) (NYSE: TXN) today announced its Consumer
Electronics WLAN Developer Kit (CE WLAN DK) 2.0.  TI's
latest development kit provides manufacturers with the
systems-level building blocks they need to add Wi-Fi
connectivity to battery-operated devices from digital still
cameras and portable media players (PMPs) to emerging
communications and entertainment applications.  

    According to Dell'Oro Group reports, wireless LANs are
increasingly used to distribute "triple-play"
services (data, voice, and video) in the home.  Dell'Oro
forecasts shipments of residential DSL gateways with
wireless LAN capability to triple from 2005 to 2008, rising
from 10 to 30 million.  To capitalize on this trend,
consumer electronics companies should look to incorporate
wireless capabilities in their products to connect to these
fast growing networks.

    Simple to Configure, Robust WLAN Connects Portable
Products

    TI brings a unique approach to the emerging CE market,
offering complete development platforms for manufacturers
to embed Wi-Fi in their devices.  The company has enabled
leading broadband providers to add WLAN to their DSL, cable
and voice products and is extending this systems-level
approach to CE.

    Products leveraging TI's recently announced CE WLAN DK
1.0 for stationary and 2.0 for portable applications enable
consumers to enjoy the most robust Wi-Fi experience
regardless of their location.  TI technology allows users
to easily configure their WLAN and exchange audio and video
files or other data wirelessly between devices like PMPs,
without the fear of dropped signals or loss of battery
power.   

    "Manufacturers must offer products with WLAN that
are easy to use, seamlessly compatible with other devices
and extend battery life at reasonable price points,"
said Steve Schnier CE WLAN product line manager with TI's
Residential Gateway and Embedded Systems business unit. 
"TI enhances the consumer's Wi-Fi experience with
simple configuration, robust connections and improved
battery life."

    Development Platform Approach Speeds Time to Market

    Manufacturers looking to embed Wi-Fi benefit from TI's
development platform approach. These systems-level tools
include host processor support, the CE WLAN DK 2.0 and
access to TI's third party network.  This approach enables
OEMs to focus on their core applications, accelerating
their development time from design through production and
reducing integration issues.   

    TI's CE WLAN DK 2.0 is built to interface directly with
leading processor platforms using an SDIO interface such as
OMAPTM processors and processors based on DaVinciTM
technology.  The CE WLAN DK 2.0 is available as part of the
platform and comprises a hardware reference design, WLAN
chipset and software driver package.  The kit is tailored
for portable applications and optimized for performance,
coverage, battery life and size.  

    Tremendous Performance in a Tiny Module 

    The CE WLAN DK 2.0 features enable best-in-class
performance and range, while also enabling longer battery
life.  The kit delivers 50 percent greater throughput and
twice the range of competing solutions.  The SDIO interface
has been maximized to deliver 20+ Mbps throughput to the
host processor while consuming minimum host resources.  The
solution also features receive sensitivities better than
-75dBm at 54 Mbps OFDM.  Portable applications can adjust
the output power to maximize reach or minimize battery use
with variable output power from 6 to 16 dBm.  

    TI's WLAN subsystem features a small form factor ideal
for portable applications.  Manufactured in 90nm advanced
RF-CMOS process, the subsystem is 11mm x 11mm x 1.5mm and
includes the media access controller (MAC) baseband (BB)
processor /radio, power amplifier, battery power
management, EEPROM, crystal and band pass filter and
associated remaining bill of materials (RBOM).  The RBOM is
just 22 components, a third of competing solutions.  

    TI's Partners Provide Design Options

    In addition to TI platforms, manufacturers can leverage
the company's partner network to speed development time and
further differentiate.  Portable partners include eSOL,
Ittiam, Ingenient, JorJin who offer products from simple
operating system (OS) ports to complete end-equipment
reference designs. 

    "By collaborating with TI, we deliver a fully
tested and calibrated module that is easily embedded in a
variety of CE devices, enabling CE manufacturers to reach
the market faster," said Tom Liang, CEO of Jorjin
Technologies, Inc., a well-established leader in embedded
WLAN in broadband devices and a member of TI's partner
network. 

    About TI's CE WLAN DK 2.0 for Portable Applications 

    TI's CE WLAN Development Kit for portable devices
includes a hardware reference design, chipset and software
driver package.

    -- Hardware Reference Design (PCA-202):  The complete
reference design 
       utilizing TI's WLAN chipset is designed to pass FCC
and Wi-Fi 
       certification, enabling manufacturers to reach the
market quickly.  

    -- WLAN Chipset (TNETW1351/TNETW3526/5100): The
TNETW1351 is the single-
       chip MAC baseband processor/radios in 90nm RF-CMOS
process technology.  
       The TNETW3526 is the power amplifier and the 5100 is
the battery power 
       management for the WLAN subsystem.  The chipset is
optimized for 
       sensitivity, minimal battery power use and small
size.  

    -- Software Driver Package (CE-STA-DK 2.0): TI's full
featured software 
       driver package enables security including Wi-Fi
Protected Access (WPA)   
       and WPA2, quality of service including Windows
Multimedia (WMM) and 
       802.11e,and, ease of use including Wi-Fi Simple
Configuration support. 
       The SDIO interface offers the highest throughput,
maximized to deliver 
       20+ Mbps, with the lowest CPU utilization. 

    Availability

    The CE WLAN DK 2.0 for portable applications is
sampling today.  For more information on TI's CE WLAN
offerings, visit http://www.ti.com/cewlan .  

    About Texas Instruments 

    Texas Instruments Incorporated provides innovative DSP
and analog technologies to meet our customers' real world
signal processing requirements. In addition to
Semiconductor, the company includes the Educational
&Productivity Solutions business. TI is headquartered
in Dallas, Texas, and has manufacturing, design or sales
operations in more than 25 countries. 

    Texas Instruments is traded on the New York Stock
Exchange under the symbol TXN. More information is located
on the World Wide Web at http://www.ti.com .

    Trademarks

    OMAP and DaVinci are trademarks of Texas Instruments. 
All other trademarks and registered trademarks are the
property of their respective owners.

    For more information, please contact:

     Sarah Martin
     Texas Instruments
     Tel:   +1-214-480-5035
     Email: smartin@ti.com

     Ramona Layne
     GolinHarris
     Tel:   +1-972-341-2532
     Email: rlayne@golinharris.com

SOURCE  Texas Instruments Incorporated
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