Quellan Cuts Kilowatts of Data Center Power and Increases Port Density by 33% with Revolutionary New Analog Chip

Quellan Cuts Kilowatts of Data Center Power and Increases Port Density by 33% with Revolutionary New Analog Chip

May 01, 2007

Company's IC Embeds in New Ultra-small QSFP Connector
Enabling Longer Reach, Thinner Cable Interconnects and
Reducing Dependency on Power Hungry Optics.


    ANAHEIM, Calif., Server Blade Summit, May 1
/Xinhua-PRNewswire/ -- 

    Quellan Incorporated, a leader in low power analog
noise cancellation ICs, has expanded its groundbreaking
family of Lane Extender ICs to enable the industry's first
Quad Small Form-factor Pluggable (QSFP) active cable.
Quellan's QLx4000 series Lane Extenders combine a
sophisticated 4-channel equalizer with integrated higher
layer functionality that ensures full compliance with the
QSFP specification. The chip may also be used in line
cards, switches, blade servers and chassis.

    "Cable weight and compute density have become
exponentially critical in next generation Data
Centers," said Joel Goergen, Chief Scientist at
Force10 Networks. "Power consumption is a paramount
issue, and the industry is devoid of low energy, small form
factor solutions for this escalating problem. Quellan's new
QSFP ready devices are an innovative answer to this massive
problem."

    Power consumption and density are paramount issues in
Data Center economics.  Today's cable interconnect conduits
can exceed 12 feet in diameter and weigh up to 3 tons, while
interconnect power consumption is heading toward megawatt
levels. Data Centers have traditionally utilized bulky,
conduit blocking cables and connectors or power hungry
fiber optics -- eroding Data Center efficiency.

    Combining the industry's new high density QSFP
connector with Quellan's Q:Active chip enables much longer,
thinner copper cabling -- eliminating the need to convert to
power hungry fiber optics. The resultant "active
cable" improves data center economics by reducing
interconnect power by hundreds of kilowatts and makes room
for thousands of additional server ports in the existing
footprint. 

    "The new QSFP connector delivers a new level of
performance and density to the Data Center," said
Gourgen Oganessyan of Molex.  "Putting Quellan inside
solves the distance and cable thickness problem -- yielding
the ultimate solution for Data Center density and
cost."

    "Extending copper on thinner gauge cable is
critical meeting customer requirements for cable
management, distance and bandwidth," said Lloyd
Dickman, CTO for InfiniBand Products at QLogic. 
"Coupling Quellan's analog technology to QSFP delivers
the additional benefit of higher density -- a winning
combination."

    The fully embeddable devices deliver 4 channels of
processing in a compact 4x7mm package for easy integration
in any cable shell, line card or backplane.  Power
dissipation is just 240mW.  Aggregate device bandwidth
ranges from 10Gbps (4x2.5Gbps) to 34Gbps (4x8.5Gbps). The
QLx4300 and 4600 are now available for sampling with prices
starting at under $2.00 per channel. The QLx4800 will be
available for sampling in Q307.
 
    "Lower power consumption and greater density are
the most important challenges our customers are
facing," said Quellan CEO, Tony Stelliga.  "So we
took the industry's smallest connector -- QSFP -- for a 33%
increase in port density and inserted our analog technology
to deliver a 300% reach extension over copper and an 80%
power savings over fiber optics -- case closed." 

    About Quellan

    Quellan's adaptive Noise Cancellation chips are a
subset of the ever expanding Analog IC market, expected to
grow to $47B in 2007. Quellan serves the Enterprise, Data
Center, Broadcast, Automotive, and Consumer Electronics
markets with ultra-low power devices that improve the
performance of wireless handsets, datacenter interconnects,
laptop computers, GPS devices and game consoles.  For more
information visit http://www.quellan.com or email
[e-mail] .


    For more information, please contact:

     Kristen Domingo, Quellan
     Tel:   [phone]
     Email: [e-mail]